ISSP

ISSP2026 Exhibition

Division of Sputtering & Plasma Processes, The Japan Society of Vacuum and Surface Science

Registration - ISSP2026 Exhibition

Welcome to the Online Exhibition Application Form System for ISSP 2026, The 18th International Symposium on Sputtering and Plasma Processes at the Kyoto Research Park from June 30 to July 3, 2026.

Application Deadline for Exhibition: May 31, 2026 (11:59pm, JST)

Log in with A-Pass (formerly Confit account)

You can move to the A-Pass login page. You will be taken to the A-Pass login page. If you are already logged in, you will be taken to the registration page.


Or

ORCID provides a permanent identifier (ORCID iD) that distinguishes you from other researchers, and a mechanism to link your research results and activities to your ORCID iD. For more information, please visit orcid.org.
For more information on Confit and ORCID collaboration, please click here.

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